Innovative Component, Reliability and Manufacturing 3D Power Packaging Solutions Session
Session Type: Lecture
Session Code: IS14
Location: Room 212
Date & Time: Wednesday March 07, 2018 (14:00 - 17:25)
Chair: Brian Narveson,
Ernie Parker

 

    Papers are listed in the order they will be presented.

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Paper
Id
TopicTitle/Author
1149 1 Conductive Fusion Technology: Advanced Die Attach Materials for High Power Applications
Nicholas Krasco, Maciej Patelka, Steve Anagnostopoulos, Sho Ikeda, ...
1151 1 Joining Materials Reliability for Evolving Power Applications
Andy C. Mackie, Hongwen Zhang, Sihai Chen, Seth Homer, Karthik Vija...
1152 1 Transient Liquid Phase Sintering Pastes As Solder Alternatives in System in Package Applications
Catherine Shearer
1153 1 Embedded Passives - Recent Advances and Opportunities: from PSMA Phase III Report
Pulugurtha Markondey Raj, Himani Sharma, Teng Sun, Robert Grant Spu...
1154 1 New Wave SiP Solution for Power
Vincent Lin
1155 1 Power Modules - a New Packaging Approach
David Cooper
1175 1 Chip Embedding in Laminate Based on Cu Leadframe for Thin Die Packaging
Klaus Pressel